Electronic Design

UCIe 3.0: Scaling Multi-Die Designs to the Next Level

UCIe 3.0 springs open the door to higher speeds, enhanced link reliability, and smarter system coordination for increasingly complex chiplet packaging needs.

Intel rolls out XeSS 3.0 with multi-frame generation, but it's still locked to Windows

The SDK introduces a substantial technical leap in multi-frame generation (MFG). By inserting up to three AI-generated frames, MFG can boost performance by up to 4x, ...
Push Square

'They're Not Going to Delay PS6': Hardware Leaker Says 2027 Still Likely After Xbox Helix Reveal

In the aftermath of Project Helix’s announcement yesterday, notorious hardware leaker Moore’s Law Is Dead has reiterated he ...
Push Square

PS6 Rival Xbox Helix Could Cost as Much as $1,200

In a breakdown of the potential specs for the next Xbox console, which runs both Xbox and PC games, YouTuber insider Moore's ...