Elimination of Pinhole Defects in Self-Aligned Double Patterning Process by using Bias Pulsed Plasma
Abstract: Self-aligned double patterning (SADP) is extensively utilized in advanced sub-20nm technology nodes. The DRAM digit contact SADP dry etch process experienced severe yield loss due to pinhole ...
Abstract: The future 6G-enabled IoT will facilitate seamless global connectivity among ubiquitous wireless devices, but this advancement also introduces heightened security risks such as spoofing ...
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