Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Wouldn’t the packaging for a big-screen TV be the perfect size for a TV stand? Yes, and a clever designer decided to do just that. We knew there were some tricky designers working on various packaging ...

During the training, home science specialist Pooja Singnale gave comprehensive demonstrations on the preparation of banana chips, including selection of raw materials, processing techniques, frying, ...

Circle packing encapsulates the challenge of optimally arranging a set of circles within a given container without overlap, a process that has profound implications in both theoretical mathematics and ...

Daphna Nissenbaum started her career in compostable plastic with the founding of TIPA Compostable Packaging in 2010 with the goal of providing a practical solution to the plastic waste challenge. "I ...